Systems and Processes for Increasing Semiconductor Device Reliability

ABSTRACT

A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

FIELD OF THE DISCLOSURE

The disclosure relates to systems for increasing semiconductor devicereliability. The disclosure further relates to processes for increasingsemiconductor device reliability.

BACKGROUND OF THE DISCLOSURE

Electrical components are typically supported on a structure havingconductive tracks, pads, and other features. The electrical componentsare typically connected to the structure with leads. For example, thestructure may be a printed circuit board (PCB) that mechanicallysupports and electrically connects the electrical components via theconductive tracks, the pads, and the other features. The electricalcomponents are typically soldered onto the support structure through theleads to both electrically connect and mechanically fasten theelectrical components to the support structure.

However, the electrical components and the support structure are oftenimplemented in environments subjected to changes in temperature.Accordingly, the electrical components are often required to passtemperature cycle tests, thermal shock tests, and the like. In thisregard, the thermal cycling of the electrical components and/or thesupport structure has been found to negatively impact the associatedlead structure and its connections between the electrical components andthe support structure. In particular, the thermal cycling of theelectrical components and/or the support structure has been found toform defects such as cracks, fatigue features, fractures, delamination,and/or the like in the connection between the lead structure and a padon which the lead structure is connected.

For example, it has been found that the leads connecting the electricalcomponents and/or the support structure started showing cracks, fatiguefeatures, fractures, delamination, and/or the like at a lead-solderinterface during the temperature cycle tests. Moreover, the defects,such as delamination, became severely worse after 1000 cycles of thetemperature cycle test. The electrical components and/or the supportstructure are required to pass temperature cycle tests, thermal shocktests, and the like. However, the above-noted defects at the lead-solderinterface can result in the electrical components and/or the supportstructure failing such temperature cycle tests, thermal shock tests, andthe like. Moreover, the above-noted defects at the lead-solder interfacecan result in the electrical components and/or the support structuresubsequently resulting in a device failure, reducing the reliabilitythereof, and the like. For example, FIG. 21 illustrates a device 1having a lead 2 that connects to a pad 3 on a support structure 4.Additionally, the lead 2 of the device 1 includes a pad 6 for connectionof the lead 2 to an electrical component 7. FIG. 21 further illustratesthat the device 1 has experienced a defect 8 in the form of adelamination. Likewise, FIG. 22 further illustrates another device 1that has experienced a defect 8 in the form of a crack. Similarly, FIG.23 further illustrates another device 1 that has experienced a defect 8in the form of a crack. The above-noted defects such as cracks, fatiguefeatures, fractures, delamination, and/or the like in the connection cantypically have a direct impact on the reliability of the device, asystem implementing the device, and the like.

Accordingly, what is needed are systems and processes to reduce theoccurrence of cracks, fatigue features, fractures, and/or thedelamination at a lead-solder interface in electrical components and/ora support structure.

The disclosure provides systems and processes to address at least oneroot cause of cracks, fatigue features, fractures, and/or thedelamination at a lead-solder interface (failure mode). In particular,the at least one root cause of the failure mode has been found to be inpart solder fatigue during a temperature excursion.

SUMMARY OF THE DISCLOSURE

One general aspect includes a system configured to increase areliability of electrical connections in a device, the system including:a lead configured to electrically connect a pad of at least one supportstructure to a pad of at least one electrical component; the leadincludes a first pad connection portion that includes a first uppersurface; the first pad connection portion configured to connect the leadto the pad of the at least one support structure; the lead includes asecond pad connection portion that includes a second upper surface; thesecond pad connection portion configured to connect the lead to the padof the at least one electrical component; the lead includes an upperportion that includes a lower surface arranged on a lower surfacethereof; the upper portion being arranged between the first padconnection portion and the second pad connection portion; where thelower surface of the upper portion is arranged vertically above thefirst upper surface of the first pad connection portion; and where thelower surface of the upper portion is arranged vertically above thesecond upper surface of the second pad connection portion.

One general aspect includes a process configured to increase areliability of electrical connections in a device, the processincluding: forming a lead that is configured to electrically connect apad of at least one support structure to a pad of at least oneelectrical component; providing the lead with a first pad connectionportion that includes a first upper surface; configuring the first padconnection portion to connect the lead to the pad of the at least onesupport structure; providing the lead with a second pad connectionportion that includes a second upper surface; configuring the second padconnection portion to connect the lead to the pad of the at least oneelectrical component; arranging the lead to include an upper portionthat includes a lower surface arranged on a lower surface thereof;arranging the upper portion between the first pad connection portion andthe second pad connection portion; arranging the lower surface of theupper portion to be vertically above the first upper surface of thefirst pad connection portion; and arranging the lower surface of theupper portion to be arranged vertically above the second upper surfaceof the second pad connection portion.

Additional features, advantages, and aspects of the disclosure may beset forth or apparent from consideration of the following detaileddescription, drawings, and claims. Moreover, it is to be understood thatboth the foregoing summary of the disclosure and the following detaileddescription are exemplary and intended to provide further explanationwithout limiting the scope of the disclosure as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure, are incorporated in and constitute apart of this specification, illustrate aspects of the disclosure andtogether with the detailed description serve to explain the principlesof the disclosure. No attempt is made to show structural details of thedisclosure in more detail than may be necessary for a fundamentalunderstanding of the disclosure and the various ways in which it may bepracticed. In the drawings:

FIG. 1 illustrates a perspective side view of a system according toaspects of the disclosure.

FIG. 2 illustrates a perspective side view of another system accordingto aspects of the disclosure.

FIG. 3 illustrates a perspective side view of another system accordingto aspects of the disclosure.

FIG. 4 illustrates a side view of the system according to FIG. 1.

FIG. 5 illustrates a side view of the system according to FIG. 4.

FIG. 6 illustrates a side view of the system according to FIG. 4.

FIG. 7 illustrates a side view of the system according to FIG. 4.

FIG. 8 illustrates a cross-sectional view of the lead of FIG. 4 alongthe lines V-V according to aspects of the disclosure.

FIG. 9 illustrates a cross-sectional view of the lead of FIG. 4 alongthe lines V-V according to aspects of the disclosure.

FIG. 10 illustrates a graph showing possible degraded signalingperformance in some implementations.

FIG. 11 illustrates a top view of a system according to aspects of thedisclosure.

FIG. 12 illustrates a side view of the system according FIG. 11.

FIG. 13 illustrates a side view of the system according FIG. 11.

FIG. 14 illustrates a side view of the system according FIG. 11.

FIG. 15 illustrates a side view of the system according to FIG. 11.

FIG. 16 illustrates a top view of the system according to FIG. 11.

FIG. 17 illustrates a top view of the system according to FIG. 11.

FIG. 18 illustrates a top view of the system according to FIG. 11.

FIG. 19 illustrates a graph showing an improved signaling performanceaccording to aspects of the disclosure.

FIG. 20 illustrates a process of implementing a system according toaspects of the disclosure.

FIG. 21 illustrates an exemplary defect in a lead.

FIG. 22 illustrates an exemplary defect in a lead.

FIG. 23 illustrates an exemplary defect in a lead.

DETAILED DESCRIPTION OF THE DISCLOSURE

The aspects of the disclosure and the various features and advantageousdetails thereof are explained more fully with reference to thenon-limiting aspects and examples that are described and/or illustratedin the accompanying drawings and detailed in the following description.It should be noted that the features illustrated in the drawings are notnecessarily drawn to scale, and features of one aspect may be employedwith other aspects, as the skilled artisan would recognize, even if notexplicitly stated herein. Descriptions of well-known components andprocessing techniques may be omitted so as not to unnecessarily obscurethe aspects of the disclosure. The examples used herein are intendedmerely to facilitate an understanding of ways in which the disclosuremay be practiced and to further enable those of skill in the art topractice the aspects of the disclosure. Accordingly, the examples andaspects herein should not be construed as limiting the scope of thedisclosure, which is defined solely by the appended claims andapplicable law. Moreover, it is noted that like reference numeralsrepresent similar parts throughout the several views of the drawings andin the different embodiments disclosed.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the disclosure. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

It will be understood that when an element such as a layer, region, orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto another elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present.Likewise, it will be understood that when an element such as a layer,region, or substrate is referred to as being “over” or extending “over”another element, it can be directly over or extend directly over anotherelement or intervening elements may also be present. In contrast, whenan element is referred to as being “directly over” or extending“directly over” another element, there are no intervening elementspresent. It will also be understood that when an element is referred toas being “connected” or “coupled” to another element, it can be directlyconnected or coupled to another element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

Relative terms such as “below” or “above” or “upper” or “lower” or“horizontal” or “vertical” may be used herein to describe a relationshipof one element, layer, or region to another element, layer, or region asillustrated in the Figures. It will be understood that these terms andthose discussed above are intended to encompass different orientationsof the device in addition to the orientation depicted in the Figures.

The terminology used herein is for the purpose of describing particularaspects only and is not intended to be limiting of the disclosure. Asused herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including” when used herein specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms used herein should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthis specification and the relevant art and will not be interpreted inan idealized or overly formal sense unless expressly so defined herein.

FIG. 1 illustrates a perspective side view of a system according toaspects of the disclosure.

FIG. 2 illustrates a perspective side view of another system accordingto aspects of the disclosure.

FIG. 3 illustrates a perspective side view of another system accordingto aspects of the disclosure.

In particular, FIG. 1, FIG. 2, and FIG. 3 illustrate a system 100configured to increase a reliability for various components in a device500. The device 500 may include the system 100, at least one supportstructure 200, at least one electrical component 300, and the like. Inother aspects, the system 100 may include the device 500, the at leastone support structure 200, the at least one electrical component 300,and the like.

In particular, the system 100 may include at least one connection 104between the at least one support structure 200 and the at least oneelectrical component 300. In one aspect, the system 100 may increase thereliability of the at least one connection 104 as further describedbelow. The at least one support structure 200 may include a pad 202; andthe at least one electrical component 300 may include a pad 302. The atleast one connection 104 may be implemented by a lead 102 thatelectrically connects the pad 202 of the at least one support structure200 to the pad 302 of the at least one electrical component 300. The atleast one connection 104 may transmit signals and/or power through thelead 102 between the at least one support structure 200 and the at leastone electrical component 300.

In one aspect, the lead 102 may include a stress relief feature 106. Inone aspect, the lead 102 may include the stress relief feature 106 thatmay in part increase the reliability of at least one connection 104and/or the device 500.

In one or more aspects, the lead 102 that includes the stress relieffeature 106 may be implemented with various shapes. In this regard, theshapes may be defined as the cross-sectional shape as viewed in a planecontaining the lead 102, the pad 202, and the pad 302, and the planebeing perpendicular to an upper surface of the at least one supportstructure 200 and/or the upper surface of the at least one electricalcomponent 300. The various shapes may include a generally curved shapedconstruction as illustrated in FIG. 1, a generally triangular shapedconstruction as illustrated in FIG. 2, a generally bow shapedconstruction as illustrated in FIG. 3, and the like.

The various shapes may also include an Aquiline shaped construction, aBell-shaped curve construction, a Biconic shaped construction, a Bowcurve shaped construction, a Bullet Nose shaped construction, a CockedHat curve shaped construction, a Bicorn shaped construction, aSerpentine shaped construction, an A-shaped construction (a shape thatresembles the capital letter A), a D-shaped construction (a shape thatresembles the capital letter D), a Circular sector shaped construction,a Circular segment shaped construction, a Crescent shaped construction,a Semicircle shaped construction, a polygonal shaped construction, afree-form shaped construction, and/or the like.

FIG. 4 illustrates a side view of the system according to FIG. 1.

In particular, FIG. 4 illustrates the details of the system 100, the atleast one support structure 200, the at least one electrical component300, the device 500, and the like. Moreover, although FIG. 4 illustratesa particular shape of the lead 102, the various other shapes of the lead102 as described herein may also likewise include the various details ofthe system 100, the at least one support structure 200, the at least oneelectrical component 300, the device 500, and the like as illustrated inFIG. 4.

In particular, the at least one support structure 200 may include anupper surface 204. In one aspect, the pad 202 may be arranged on theupper surface 204. In one aspect, the pad 202 may be arranged directlyon the upper surface 204. In one aspect, the pad 202 may be arranged inthe upper surface 204. In one aspect, the upper surface 204 of the atleast one support structure 200 may be generally planar. In one aspect,an upper surface 206 of the pad 202 may be generally planar. On the pad202, a lead-solder interface 208 may be formed between the lead 102 andthe pad 202. In particular, the lead 102 may have a lower surface 114and the lead-solder interface 208 may be formed between the lowersurface 114 and the upper surface 206 of the pad 202.

FIG. 4 further illustrates that the at least one electrical component300 may include an upper surface 304. In one aspect, the pad 302 may bearranged on the upper surface 304. In one aspect, the pad 302 may bearranged directly on the upper surface 304. In one aspect, the pad 302may be arranged in the upper surface 304. In one aspect, the uppersurface 304 of the at least one electrical component 300 may begenerally planar. In one aspect, an upper surface 306 of the pad 302 maybe generally planar. On the pad 302, a lead-solder interface 308 may beformed between the lead 102 and the pad 302. In particular, the lead 102may have a lower surface 124 and the lead-solder interface 308 may beformed between the lower surface 124 and the upper surface 306 of thepad 302.

In one aspect, the lower surface 114 of the lead 102 may be located in aplane 152 and the lower surface 124 of the lead 102 may be located in aplane 150. The plane 152 and the plane 150 may be vertically offset asillustrated in FIG. 4. In one aspect, the lower surface 114 of the lead102 may be located in the plane 152 and the lower surface 124 of thelead 102 may be located in the plane 150 and the plane 152 and the plane150 may be vertically at the same vertical height (not shown).

In one aspect, the lead 102 may be formed of a metallic material. In oneaspect, the lead 102 may be formed of a metallic material such ascopper, a nickel-cobalt ferrous alloy, Kovar™, or the like.

In one aspect, the pad 202 arranged on the at least one supportstructure 200 may comprise a metallic material. In one aspect, the pad202 arranged on the at least one support structure 200 may comprise ametallic material such as copper, gold, nickel, and the like, andcombinations thereof.

In one aspect, the pad 302 arranged on the at least one electricalcomponent 300 may comprise a metallic material. In one aspect, the pad202 arranged on the at least one electrical component 300 may comprise ametallic material such as copper, gold, nickel, and the like, andcombinations thereof.

In one aspect, the lead-solder interface 208 and/or the lead-solderinterface 308 may include solder and/or be formed from solder. Thesolder may be any fusible metal alloy that may be used to form a bondbetween the lower surface 114 and the pad 202 and the lower surface 124and the pad 302. The solder may be a lead-free solder, a lead solder, orthe like. The lead-free solder may contain tin, copper, silver, bismuth,indium, zinc, antimony, traces of other metals, and/or the like. Thelead solder may contain lead, other metals such as tin, and/or the like.The solder may further include flux as needed.

FIG. 5 illustrates a side view of the system according to FIG. 4.

In particular, FIG. 5 further illustrates details of the lead 102. Inthis regard, although FIG. 5 illustrates a particular shape of the lead102, the various other shapes of the lead 102 as described herein mayalso likewise include the various details of the lead 102 as furtherdescribed herein.

The lead 102 may include a pad connection portion 116. The padconnection portion 116 may include the lower surface 114 arranged on thelower surface thereof. The pad connection portion 116 may furtherinclude an upper surface 118.

In one aspect, the pad connection portion 116 may be generally flat. Inone aspect, the upper surface 118 may be generally parallel to the plane152. In one aspect, the lower surface 114 may be within and generallyparallel to the plane 152.

The lead 102 may include a pad connection portion 126. The padconnection portion 126 may include the lower surface 124 arranged on thelower surface thereof. The pad connection portion 126 may furtherinclude an upper surface 128.

In one aspect, the pad connection portion 126 may be generally flat. Inone aspect, the upper surface 128 may be generally flat. In one aspect,the upper surface 128 may be generally parallel to the plane 150. In oneaspect, the lower surface 124 may be generally flat. In one aspect, thelower surface 124 may be generally parallel to and within the plane 150.

In one aspect, the plane 152 and the plane 150 may be vertically offsetas illustrated in FIG. 5. In one aspect, the plane 152 and the plane 150may be vertically at the same vertical height (not shown).

The lead 102 may include an upper portion 130. The upper portion 130 mayinclude a lower surface 132 arranged on a lower surface thereof. Theupper portion 130 may include an upper surface 134 arranged on the uppersurface thereof. In one aspect, the upper portion 130 may be arrangedbetween the pad connection portion 116 and the pad connection portion126.

The lead 102 may include a connection portion 140 that connects betweenthe pad connection portion 116 and the upper portion 130. The connectionportion 140 may have an upper surface and a lower surface. In oneaspect, the connection portion 140 may curve upwardly from the plane 152from the pad connection portion 116 to connect to the upper portion 130.

The lead 102 may include a connection portion 142 that connects betweenthe pad connection portion 126 and the upper portion 130. The connectionportion 142 may have an upper surface and a lower surface. In oneaspect, the connection portion 142 may curve upwardly from the plane 150from the pad connection portion 126 to connect to the upper portion 130.

In one aspect, the upper portion 130 may have a curved construction asillustrated in FIG. 1 and FIG. 5. In one aspect, the upper portion 130may have a curved construction extending between the connection portion140 and the connection portion 142 as illustrated in FIG. 1 and FIG. 5.In one aspect, the upper portion 130 may have a curved convexconstruction as illustrated in FIG. 1 and FIG. 5.

In one aspect, the upper portion 130 may have a curved triangular-shapedconstruction as illustrated in FIG. 2. In one aspect, the upper portion130 may have a curved triangular-shaped construction extending betweenthe connection portion 140 and the connection portion 142 as illustratedin FIG. 2. In one aspect, the upper portion 130 may have a curved convexconstruction as illustrated in FIG. 2.

In one aspect, the upper portion 130 may have a bow-shaped constructionas illustrated in FIG. 3. In one aspect, the upper portion 130 may havea curved bow-shaped construction extending between the connectionportion 140 and the connection portion 142 as illustrated in FIG. 3. Inone aspect, the upper portion 130 may have a curved convex constructionas illustrated in FIG. 3.

In one aspect, the connection portion 140 may have a curvedconstruction. In one aspect, the connection portion 140 may have acurved construction extending between the pad connection portion 116 andthe upper portion 130. In one aspect, the connection portion 140 mayhave a concave curved construction. In one aspect, the connectionportion 140 may have a concave curved construction extending between thepad connection portion 116 and the upper portion 130.

In one aspect, the connection portion 142 may have a curvedconstruction. In one aspect, the connection portion 142 may have acurved construction extending between the pad connection portion 126 andthe upper portion 130. In one aspect, the connection portion 142 mayhave a concave curved construction. In one aspect, the connectionportion 142 may have a concave curved construction extending between thepad connection portion 116 and the upper portion 130.

In one aspect, the lower surface 132 may be arranged vertically abovethe lower surface 114 with respect to the plane 152. In one aspect, thelower surface 132 may be arranged vertically above the lower surface 124with respect to the plane 150.

In one aspect, the lower surface 132 may be arranged vertically abovethe lower surface 114 with respect to the plane 152 and the lowersurface 132 may be arranged vertically above the lower surface 124 withrespect to the plane 150.

In one aspect, the lower surface 132 may be arranged vertically abovethe upper surface 118 with respect to the plane 152. In one aspect, thelower surface 132 may be arranged vertically above the upper surface 128with respect to the plane 150. In one aspect, the lower surface 132 maybe arranged vertically above the upper surface 118 with respect to theplane 152 and the lower surface 132 may be arranged vertically above theupper surface 128 with respect to the plane 150.

In one aspect, portions of the connection portion 140 may be arrangedvertically above the lower surface 114 with respect to the plane 152. Inone aspect, portions of the connection portion 142 may be arrangedvertically above the lower surface 124 with respect to the plane 150. Inone aspect, portions of the connection portion 140 may be arrangedvertically above the lower surface 114 with respect to the plane 152 andportions of the connection portion 142 may be arranged vertically abovethe lower surface 124 with respect to the plane 150.

In one aspect, portions of the connection portion 140 may be arrangedvertically above the upper surface 118 with respect to the plane 152. Inone aspect, portions of the connection portion 142 may be arrangedvertically above the upper surface 128 with respect to the plane 150. Inone aspect, portions of the connection portion 140 may be arrangedvertically above the upper surface 118 with respect to the plane 152 andportions of the connection portion 142 may be arranged vertically abovethe upper surface 128 with respect to the plane 150.

FIG. 6 illustrates a side view of the system according to FIG. 4.

In particular, FIG. 6 further illustrates details of the lead 102. Inthis regard, although FIG. 6 illustrates a particular shape of the lead102, the various other shapes of the lead 102 as described herein mayalso likewise include the various details of the lead 102 as furtherdescribed herein.

As illustrated in FIG. 6, the lead 102 may include a first end portion136 and a second end portion 146. In one aspect, the first end portion136 may form a terminating end of the lead 102 (left end of the lead102); and the second end portion 146 may form a terminating end of thelead 102 (right end of the lead 102). A linear distance 162 from thefirst end portion 136 to the second end portion 146 is illustrated inFIG. 6. In other words, the linear distance 162 from the first endportion 136 to the second end portion 146 may be the dimensional lineardistance from the first end portion 136 to the second end portion 146.

A curved distance 160 from the first end portion 136 to the second endportion 146 is also illustrated in FIG. 6. The curved distance 160includes a length of the pad connection portion 116, a length of theconnection portion 140, a length of the upper portion 130, a length ofthe connection portion 142, and a length of the pad connection portion126. In other words, the curved distance 160 may be the length of thelead 102 if it was flattened.

In one aspect, the curved distance 160 of the lead 102 is greater thanthe linear distance 162. In one aspect, the curved distance 160 of thelead 102 is 5% to 50% greater, 5% to 10% greater, 10% to 15% greater,15% to 20% greater, 20% to 25% greater, 25% to 30% greater, 30% to 40%greater, 40% to 50% greater than the linear distance 162.

FIG. 7 illustrates a side view of the system according to FIG. 4.

In particular, FIG. 7 further illustrates details of the lead 102. Inthis regard, although FIG. 7 illustrates a particular shape of the lead102, the various other shapes of the lead 102 as described herein mayalso likewise include the various details of the lead 102 as furtherdescribed herein.

FIG. 7 further illustrates a vertical height 166 or thickness of the padconnection portion 116. In one aspect, the vertical height 166 of thepad connection portion 116 may be defined as a distance from the plane152 and/or the lower surface 114 to the upper surface 118 as illustratedin FIG. 7.

FIG. 7 further illustrates a vertical height 164 of the upper surface134 of the upper portion 130. In one aspect, the vertical height 164 ofthe upper portion 130 may be defined as a distance from the plane 152and/or the lower surface 114 to the upper surface 134 as illustrated inFIG. 7.

In one aspect, the vertical height 164 of the upper surface 134 of theupper portion 130 may be greater than the vertical height 166 of the padconnection portion 116.

In one aspect, the vertical height 164 of the upper portion 130 may be 2to 20 times greater, 2 to 4 times greater, 4 to 6 times greater, 6 to 8times greater, 8 to 10 times greater, 10 to 12 times greater, 12 to 14times greater, 14 to 16 times greater, 16 to 18 times greater, or 18 to20 times greater than the vertical height 166 of the pad connectionportion 116.

In one aspect, the vertical height 164 of the upper portion 130 may be 2to 20 times greater, 2 to 4 times greater, 4 to 6 times greater, 6 to 8times greater, 8 to 10 times greater, 10 to 12 times greater, 12 to 14times greater, 14 to 16 times greater, 16 to 18 times greater, or 18 to20 times greater than the vertical height of the pad connection portion126.

In particular, the one or more aspects of the construction of the lead102 described herein may allow the lead 102 and/or the stress relieffeature 106 to flex during changes in temperature that may be associatedwith movement of the various components of the device 500 that mayexperience thermal excursion, thermal expansion, temperature changes,and/or the like reducing stress in the lead-solder interface 208 and/orthe lead-solder interface 308.

FIG. 8 illustrates a cross-sectional view of the lead of FIG. 4 alongthe lines V-V according to aspects of the disclosure.

In particular, FIG. 8 illustrates a cross-sectional view of the lead 102that forms the at least one connection 104. The lead 102 may have asmaller and/or thinner construction in comparison to prior art leads andmay further provide the functionality of the system 100 to increasereliability of the at least one connection 104 increase reliability ofthe lead-solder interface 208, and/or increase reliability of thelead-solder interface 308. As shown in FIG. 8, the lead 102 may have agenerally rectangular cross-sectional shape as illustrated in FIG. 8, agenerally square (not shown), and/or the like. In this regard, the lead102 may have a width 108, a height 110, and an area 112. One or more ofthe width 108, the height 110, and the area 112 may be less than priorart leads in order to further provide the functionality of the system100 to increase reliability of the at least one connection 104, increasereliability of the lead-solder interface 208, and/or increasereliability of the lead-solder interface 308. In particular, the smallerand/or thinner construction of the lead 102 may allow the lead 102and/or the stress relief feature 106 to flex during changes intemperature that may be associated with movement of the variouscomponents of the device 500 that may experience thermal excursion,thermal expansion, temperature changes, and/or the like reducing stressin the lead-solder interface 208 and/or the lead-solder interface 308.

In one aspect, the lead 102 may have a smaller and/or thinnerconstruction along the entire length thereof.

In one aspect, the lead 102 may have a smaller and/or thinnerconstruction along a portion of the entire length thereof.

In one aspect, the lead 102 may have a smaller and/or thinnerconstruction in one of the pad connection portion 116, the connectionportion 140, the upper portion 130, the connection portion 142, and/orthe pad connection portion 126.

In one aspect, the width 108 may be 5% to 50% less, 5% to 10% less, 10%to 15% less, 15% to 20% less, 20% to 30% less, 30% to 40% less, or 40%to 50% less than a width of a prior art lead.

In one aspect, the height 110 may be 5% to 50% less, 5% to 10% less, 10%to 15% less, 15% to 20% less, 20% to 30% less, 30% to 40% less, or 40%to 50% less than a height of a prior art lead.

In one aspect, the area 112 may be 5% to 50% less, 5% to 10% less, 10%to 15% less, 15% to 20% less, 20% to 30% less, 30% to 40% less, or 40%to 50% less than an area of a prior art lead.

FIG. 9 illustrates a cross-sectional view of the lead of FIG. 4 alongthe lines V-V according to aspects of the disclosure.

In particular, FIG. 9 illustrates a cross-sectional view of the lead 102that forms the at least one connection 104. The lead 102 may have asmaller and/or thinner construction in comparison to prior art leads inorder to further provide the functionality of the system 100 to increasereliability of the at least one connection 104, increase reliability ofthe lead-solder interface 208, and/or increase reliability of thelead-solder interface 308. As shown in FIG. 9, the lead 102 may have agenerally circular cross-sectional shape as illustrated in FIG. 9 or agenerally oval cross-sectional shape (not shown). In this regard, thelead 102 may have a width 108 (or diameter) and an area 112. One or moreof the width 108 and the area 112 may be less than prior art leads inorder to further provide the functionality of the system 100 to increasereliability of the at least one connection 104, increase reliability ofthe lead-solder interface 208, and/or increase reliability of thelead-solder interface 308. In particular, the smaller and/or thinnerconstruction of the lead 102 may allow the lead 102 and/or the stressrelief feature 106 to flex during changes in temperature that may beassociated with movement of the various components of the device 500that may experience thermal excursion, thermal expansion, temperaturechanges, and/or the like reducing stress in the lead-solder interface208 and/or the lead-solder interface 308.

In one aspect, the lead 102 may have a smaller and/or thinnerconstruction along the entire length thereof.

In one aspect, the lead 102 may have a smaller and/or thinnerconstruction along a portion of the entire length thereof.

In one aspect, the lead 102 may have a smaller and/or thinnerconstruction in one of the pad connection portion 116, the connectionportion 140, the upper portion 130, the connection portion 142, and/orthe pad connection portion 126.

In one aspect, the width 108 may be 5% to 50% less, 5% to 10% less, 10%to 15% less, 15% to 20% less, 20% to 30% less, 30% to 40% less, or 40%to 50% less than a width of a prior art lead.

In one aspect, the area 112 may be 5% to 50% less, 5% to 10% less, 10%to 15% less, 15% to 20% less, 20% to 30% less, 30% to 40% less, or 40%to 50% less than an area of a prior art lead.

The lead 102 may be formed with a forming tool. In one aspect, theforming tool may be a die. In one aspect, the forming tool may cut orshape the lead 102 using a press. The forming tool may include any oneor more of a die block, a punch plate, a blank punch, a pierce punch, astripper plate, a pilot, a guide, a back gauge, or finger stop, asetting block, blanking die, a pierce die, a shank, and/or the like.

In aspects, the stress relief feature 106 may include one or more of thelead 102, the smaller and/or thinner construction of the lead 102, thepad connection portion 116, the connection portion 140, the upperportion 130, the connection portion 142, the pad connection portion 126and/or the like as disclosed herein.

In aspects, the lead 102 and/or the stress relief feature 106 may beconfigured to flex during changes in temperature that may be associatedwith movement of the various components of the device 500 that mayexperience thermal excursion, thermal expansion, temperature changes,and/or the like.

In aspects, the lead 102 and/or the stress relief feature 106 may beconfigured to reduce the stress in the lead-solder interface 208 and thelead-solder interface 308. In aspects, the lead 102 and/or the stressrelief feature 106 may be configured to reduce the stress in thelead-solder interface 208 and the lead-solder interface 308 duringthermal excursions.

In aspects, the lead 102 and/or the stress relief feature 106 may beconfigured to reduce solder fatigue in the lead-solder interface 208 andthe lead-solder interface 308. In aspects, the lead 102 and/or thestress relief feature 106 may be configured to reduce solder fatigue inthe lead-solder interface 208 and the lead-solder interface 308 duringthermal excursions.

In aspects, the lead 102 and/or the stress relief feature 106 may beconfigured to reduce defects in the lead-solder interface 208 and thelead-solder interface 308. In aspects, the lead 102 and/or the stressrelief feature 106 may be configured to reduce defects in thelead-solder interface 208 and the lead-solder interface 308 duringthermal excursions. The defects may include cracks, fatigue features,fractures, delamination, and/or the like.

Additionally, the system 100 implementing the lead 102 and/or the stressrelief feature 106 reduces failure modes and defects such as cracks,fatigue features, fractures, delamination, and/or the like in theconnection between one or more of the lead 102, the lead-solderinterface 208, the lead-solder interface 308, the pad 202, the pad 302,and the like.

Moreover, the system 100 implementing the lead 102 and/or the stressrelief feature 106 ensures a greater number of the devices 500 passingthermal shock tests, temperature cycle tests, and/or the like.

In one or more aspects, the at least one support structure 200 may beconfigured to mechanically support and electrically connect the at leastone electrical component 300 and other electronic components. In one ormore aspects, the at least one support structure 200 may includeconductive tracks, pads, the pad 202, and other features. In one or moreaspects, the at least one support structure 200 may be etched from oneor more sheet layers of metallic materials, such as copper, that may belaminated onto and/or between sheet layers of a non-conductive substratematerials. The at least one electrical component 300 and the otherelectronic components may be generally soldered onto the at least onesupport structure 200 to both electrically connect and mechanicallyfasten the at least one electrical component 300 and other electroniccomponents to the at least one support structure 200 with at least oneof the lead 102 as disclosed herein.

The at least one support structure 200 may be single-sided (one metalliclayer), double-sided (two metallic layers on both sides of one substratelayer), or multi-layer (outer and inner layers of copper, alternatingwith layers of substrate). The at least one support structure 200 mayinclude separate conducting lines, tracks, circuit traces, pads forconnections, vias to pass connections between layers of copper, andfeatures such as solid conductive areas for EM shielding or otherpurposes.

The at least one support structure 200 may include conductors ondifferent layers that may be connected with vias, which may be metallicplated holes, such as copper-plated holes, that may function aselectrical tunnels through the insulating substrate. The at least onesupport structure 200 may include “Through hole” components that may bemounted by their wire leads passing through the at least one supportstructure 200 and soldered to traces on the other side. The at least onesupport structure 200 may include “Surface mount” components that may beattached by their leads, including at least one of the lead 102 asdisclosed herein, to copper traces on the same side of the at least onesupport structure 200.

In one aspect, the at least one support structure 200 may be a co-planarwave-guide (CPWG) that may be fabricated using printed circuit boardtechnology. In this aspect, the at least one support structure 200 mayinclude a conducting track printed onto a dielectric substrate, togetherwith one or more return conductors, at least one to either side of thetrack. In this regard, the conductors may be on a same side of thesubstrate, and hence may be coplanar.

The at least one support structure 200 may be manufactured utilizing oneor more manufacturing techniques including silk screen printingprocesses, photoengraving processes, print onto transparent filmprocesses, photo mask processes, photo-sensitized board processes, laserresist ablation processes, milling processes, laser etching processes,and/or like processes. In one or more aspects, the at least one supportstructure 200 may be a printed circuit board (PCB).

The at least one electrical component 300 may include any electricalcomponent for any application. In one aspect, the at least oneelectrical component 300 may be an RF (Radio Frequency) component. Inone aspect, the at least one electrical component 300 may be asilicon-carbide Schottky diode, a MOSFET (metal-oxide-semiconductorfield-effect transistor), a power module, a gate driver, and the like.In one aspect, the at least one electrical component 300 may be an RF(Radio Frequency) component such as a General-Purpose Broadbandcomponent, a Telecom component, a L-Band component, a S-Band component,a X-Band component, a C-Band component, a Ku-Band component, a SatelliteCommunications component, and the like.

In one aspect, the at least one electrical component 300 may be ahigh-electron mobility transistor (HEMT). In this regard, the HEMT maybe Group III-Nitride based devices and such HEMTs are very promisingcandidates for high power Radio Frequency (RF) applications, for lowfrequency high power switching applications, as well as otherapplications. For example, the material properties of GroupIII-nitrides, such as GaN and its alloys, enable achievement of highvoltage and high current, along with high RF gain and linearity for RFapplications. A typical Group III-nitride HEMT relies on the formationof a two-dimensional electron gas (2DEG) at the interface between ahigher band gap Group-III nitride (e.g., AlGaN) barrier layer and alower band gap Group-III nitride material (e.g., GaN) buffer layer,where the smaller band gap material has a higher electron affinity. The2DEG is an accumulation layer in the smaller band gap material and cancontain a high electron concentration and high electron mobility.

FIG. 10 illustrates a graph showing possible degraded signalingperformance in some implementations.

In particular, FIG. 10 illustrates a possible degraded signalingperformance based on a bivariate fit of S11 (dB) by frequency (GHz). Inparticular implementations, the system 100 utilizing the lead 102implementing a non-flat construction as described by the disclosure mayin some implementations degrade signaling performance between the atleast one support structure 200 and the at least one electricalcomponent 300.

In one aspect, the RF performance may be defined by scatteringparameters or S-parameters that may describe an electrical behavior ofthe device 500. The S-parameters may include gain, return loss, voltagestanding wave ratio (VSWR), reflection coefficient, and/or the like.

For example, the system 100 utilizing the lead 102 as described by thedisclosure may in some implementations degrade signaling performancebetween the at least one support structure 200 and the at least oneelectrical component 300 when the at least one electrical component 300is implemented as a radiofrequency device. In this regard, the at leastone electrical component 300 configured a radiofrequency device may berequired to maintain a high radiofrequency (RF) performance at arequired frequency range. For example, the RF performance directed toinput return loss (S11) may be higher in some aspects utilizing thesystem 100 having the lead 102. In this regard, FIG. 10 illustrates thatthe POR (point of reference) bivariate fit of S11 (dB) by frequency(GHz) implementing a prior art flat lead may have lower S11 values(better) in comparison to the S11 values for the system 100 (for examplein the frequency range of 10-10.5 GHz for some implementations). Inother words, the system 100 may experience signaling degradationrealized by the lead 102 and/or the stress relief feature 106 of thesystem 100.

FIG. 11 illustrates a top view of a system according to aspects of thedisclosure.

FIG. 12 illustrates a side view of the system according FIG. 11.

FIG. 13 illustrates a side view of the system according FIG. 11.

FIG. 14 illustrates a side view of the system according FIG. 11.

FIG. 15 illustrates a side view of the system according to FIG. 11.

In particular, FIG. 11 illustrates an element 600 implemented by thesystem 100. The element 600 may be configured to alleviate signalingdegradation realized by the lead 102 and/or the stress relief feature106 of the system 100. In one aspect, the element 600 may be implementedwith a metallic portion, a metallic component, a metallic pad, and/orthe like (hereinafter metallic pad for brevity) arranged under thestress relief feature 106 and/or the lead 102. In one aspect, theelement 600 may be implemented with a metallic pad that is electricallyconnected to the pad 202. In one aspect, the element 600 may beimplemented with a metallic pad that is electrically isolated from thepad 202. In one aspect, the element 600 may add a shunt capacitance,which counteracts an additional parasitic inductance caused by the lead102 and/or the stress relief feature 106.

As illustrated in FIG. 12, the element 600 may be implemented with ametallic pad that is on the pad 202. In one aspect, the element 600 maybe implemented with a metallic pad that is on the at least one supportstructure 200. In one aspect, the element 600 may be implemented with ametallic pad that is partially directly on the at least one supportstructure 200.

As illustrated in FIG. 13, the element 600 may be implemented with ametallic pad that is adjacent the pad 202. In one aspect, the element600 may be implemented with a metallic pad that is on the at least onesupport structure 200. In one aspect, the element 600 may be implementedwith a metallic pad that is directly on the at least one supportstructure 200.

As illustrated in FIG. 14, the element 600 may be implemented with ametallic pad that is at least partially below the pad 202. In oneaspect, the element 600 may be implemented with a metallic pad that ison the at least one support structure 200. In one aspect, the element600 may be implemented with a metallic pad that is directly on the atleast one support structure 200. In one aspect, the element 600 may beimplemented with a metallic pad that is partially within the at leastone support structure 200.

As illustrated in FIG. 15, the element 600 may be implemented with ametallic pad that is below the pad 202. In one aspect, the element 600may be implemented with a metallic pad that is on a lower side of the atleast one support structure 200. In one aspect, the element 600 may beimplemented with a metallic pad that is directly on a lower side of theat least one support structure 200. In one aspect, the element 600 mayhave a rectangular shape. In other aspects, the element 600 may have apolygonal shape, a freeform shape, a circular shape, or the like.

FIG. 16 illustrates a top view of the system according to FIG. 11.

In particular, FIG. 16 illustrates various exemplary dimensions of theelement 600. In particular, the element 600 may include a length 602, awidth 604, and a thickness 606 (see FIG. 12). The pad 202 may include alength 282, a width 284, and a thickness 286 (see FIG. 12).

In one aspect, the length 602 of the element 600 is greater than thelength 282 of the at least one support structure 200. In one aspect, thelength 602 of the element 600 is 100% to 1000%, 100% to 200%, 200% to300%, 300% to 400%, 400% to 500%, 500% to 600%, 600% to 700%, 700% to800%, or 900% to 1000% wider than the length 282 of the at least onesupport structure 200.

In one aspect, a width 604 of the element 600 is less than the width 284of the at least one support structure 200. In one aspect, a width 604 ofthe element 600 is 10% to 600%, 10% to 100%, 100% to 200%, 200% to 300%,300% to 400%, 400% to 500%, or 500% to 600% less than the width 284 ofthe at least one support structure 200.

In one aspect, the thickness 606 of the element 600 is the same as thethickness 286 of the pad 202.

In one aspect, the thickness 606 of the element 600 is less than thethickness 286 of the pad 202. In one aspect, the thickness 606 of theelement 600 is 10% to 300%, 10% to 50%, 50% to 100%, 100% to 200%, or200% to 300% less than the thickness 286 of the pad 202.

In one aspect, the thickness 606 of the element 600 is greater than thethickness 286 of the pad 202. In one aspect, the thickness 606 of theelement 600 is 10% to 300%, 10% to 50%, 50% to 100%, 100% to 200%, or200% to 300% greater than the thickness 286 of the pad 202.

In various aspects, the size of the element 600 size can be changed pera shape of the lead 102 and/or the stress relief feature 106, a locationof the lead 102 and/or the stress relief feature 106, an RF devicenature of the at least one electrical component 300, and/or the like.

In this regard, a substantial number of RF performance issues may besolved by adding the element 600. In various aspects, the element 600improves the radio frequency performance. In various aspects, theelement 600 improves the radio frequency performance including improvinga return loss (S11).

FIG. 17 illustrates a top view of the system according to FIG. 11.

In particular, FIG. 17 illustrates the element 600 implemented by thesystem 100 as described herein. The element 600 being configured toalleviate signaling degradation realized by the lead 102 of the system100. Additionally, in certain aspects, it may be beneficial to implementthe at least one support structure 200 to include a zone 170 thatincludes the element 600. In particular, the zone 170 may be an area inthe at least one support structure 200 that includes no additionalfeatures and/or a limited number of additional features. The additionalfeatures in the at least one support structure 200 may interfere withthe element 600. In one aspect, the additional features in the at leastone support structure 200 may create a capacitance between ground andthe element 600.

In one aspect, the additional features of the at least one supportstructure 200 may include conducting lines, tracks, circuit traces, padsfor connections, vias, and the like. Accordingly, in one or moreaspects, the at least one support structure 200 may be implemented withthe zone 170 that does not include any additional features and/or alimited number of additional features.

FIG. 18 illustrates a top view of the system according to FIG. 11.

In particular, FIG. 18 illustrates the element 600 implemented by thesystem 100 as described herein. The element 600 being configured toalleviate signaling degradation realized by the lead 102 of the system100. Additionally, in certain aspects, it may be beneficial to implementthe at least one support structure 200 to include the zone 170 thatincludes the element 600. In particular, the zone 170 may be an area inthe at least one support structure 200 that includes no additionalfeatures and/or a limited number of additional features. The additionalfeatures in the at least one support structure 200 may interfere withthe element 600. In one aspect, the additional features in the at leastone support structure 200 may create a capacitance between ground andthe element 600.

As further illustrated in FIG. 18, the zone 170 does not include traces262 and vias 260. In particular, the zone 170 that includes the element600 may not include any additional features such as the traces 262, thevias 260, and/or the like.

In one aspect, the element 600 may be implemented in the at least onesupport structure 200 where the at least one support structure 200 isimplemented as a Co-Planar Wave Guide (CPWG) PCB. In this regard, theelement 600 may create a capacitance between ground and the element 600.In this aspect, the capacitance may be addressed by stopping at leastthe vias 260 in the zone 170 within a location of the element 600 asillustrated in FIG. 18.

In certain aspects, the element 600 implemented in the at least onesupport structure 200 implemented as a CPWG PCB may maintain thebenefits of a CPWGs that include a small size, low cost, ease ofmanufacturing, easy access to signal line, lower dispersion, and thelike, while improving signal performance including return loss (S11).

FIG. 19 illustrates a graph showing an improved signaling performanceaccording to aspects of the disclosure.

In particular, FIG. 19 illustrates that the system 100 implementing thelead 102, the stress relief feature 106, the element 600, the zone 170,and the like provide commensurate signaling performance based on abivariate fit of S11 (dB) by frequency (GHz) to that of implementationswith a flat lead in particular implementations.

More specifically, FIG. 19 illustrates a plot 900 that is a comparisonof the lead 102 with tuning versus a flat lead without tuning. As shownin FIG. 19, the plot 900 demonstrates that even with implementation ofthe lead 102 having a bent configuration (lead 102 with stress relieffeature 106), the disclosed system may have performance equivalent tothat of the flat lead without tuning.

With reference to FIG. 19, traces 904, 906 relate to a flat lead withouttuning and traces 902, 908 relate to bent leads (lead 102 with stressrelief feature 106) with tuning. In particular, the trace 908 is a gainof the device with the bent lead (lead 102 with stress relief feature106) with tuning, the trace 902 is the return loss (how much signal islost by reflection) of the device with the bent lead (lead 102 withstress relief feature 106) with tuning, the trace 906 is the gain of thedevice with a flat lead without tuning, and the trace 904 is the returnloss of the device with a flat lead without tuning.

FIG. 20 illustrates a process of implementing a system according toaspects of the disclosure.

In particular, FIG. 20 illustrates a process for increasingsemiconductor device reliability 800.

As illustrated in box 802, the lead 102 having the stress relief feature106 may be formed. In one aspect, the lead 102 may be formed with aforming tool as described herein.

The lead 102 may be formed with various shapes of as described herein.The lead 102 may include a pad connection portion 116. The padconnection portion 116 may include the lower surface 114 arranged on thelower surface thereof. The pad connection portion 116 may furtherinclude an upper surface 118. The lead 102 may include a pad connectionportion 126. The pad connection portion 126 may include the lowersurface 124 arranged on the lower surface thereof. The pad connectionportion 126 may further include an upper surface 128. The lead 102 mayinclude an upper portion 130. The upper portion 130 may include a lowersurface 132 arranged on a lower surface thereof. The upper portion 130may include an upper surface 134 arranged on the upper surface thereof.

The lead 102 may include a connection portion 140 that connects betweenthe pad connection portion 116 and the upper portion 130. The connectionportion 140 may have an upper surface and a lower surface.

The lead 102 may include a connection portion 142 that connects betweenthe pad connection portion 126 and the upper portion 130. The connectionportion 142 may have an upper surface and a lower surface.

The lead 102 may further include any and all features, configurations,arrangements, implementations, aspects and/or the like as describedherein.

As illustrated in box 804, the at least one support structure 200 may beprovided. In one or more aspects, the at least one support structure 200may be configured to mechanically support and electrically connect theat least one electrical component 300 and other electronic components.In one or more aspects, the at least one support structure 200 mayinclude conductive tracks, pads, the pad 202, and other features. The atleast one support structure 200 may further include any and allfeatures, configurations, arrangements, implementations, aspects and/orthe like as described herein.

As illustrated in box 806, a lead-solder interface 208 may be formedbetween the lead 102 and the pad 202 for attachment of the lead 102 tothe pad 202 of the at least one support structure 200. In particular,the lead 102 may have a lower surface 114 and the lead-solder interface208 may be formed between the lower surface 114 and the upper surface206 of the pad 202.

The attachment of the lead 102 to the at least one support structure 200may further include any and all features, configurations, arrangements,implementations, aspects and/or the like as described herein.

As illustrated in box 808, the at least one electrical component 300 maybe provided. The at least one electrical component 300 may include anyelectrical component for any application. In one aspect, the at leastone electrical component 300 may be an RF (Radio Frequency) component.In one aspect, the at least one electrical component 300 may be asilicon-carbide Schottky diode, a MOSFET (metal-oxide-semiconductorfield-effect transistor), a power module, a gate driver, and the like.In one aspect, the at least one electrical component 300 may be an RF(Radio Frequency) component such as a General-Purpose Broadbandcomponent, a Telecom component, a L-Band component, a S-Band component,a X-Band component, a C-Band component, a Ku-Band component, a SatelliteCommunications component, and the like. In one aspect, the at least oneelectrical component 300 may be a high-electron mobility transistor(HEMT). The at least one electrical component 300 may further includeany and all features and aspects as described herein.

As illustrated in box 810, a lead-solder interface 308 may be formedbetween the lead 102 and the pad 302 for attaching the lead 102 to theat least one electrical component 300. In particular, the lead 102 mayhave a lower surface 124 and the lead-solder interface 308 may be formedbetween the lower surface 124 and the pad 302. The attachment of thelead 102 to the at least one electrical component 300 may furtherinclude any and all features, configurations, arrangements,implementations, aspects and/or the like as described herein.

As illustrated in box 812 the zone 170 may be provided. In particular,the zone 170 may be an area in the at least one support structure 200that includes no additional features and/or a limited number ofadditional features.

The zone 170 may further include any and all features, configurations,arrangements, implementations, aspects and/or the like as describedherein.

As illustrated in box 814, the element 600 may be provided.

In one aspect, the element 600 may be implemented with a metallic padthat is electrically connected to the pad 202. In one aspect, theelement 600 may be implemented with a metallic pad that is electricallyisolated from the pad 202. In one aspect, the element 600 may add ashunt capacitance, which counteracts an additional parasitic inductancecaused by the lead 102 and/or the stress relief feature 106.

The element 600 may further include any and all features,configurations, arrangements, implementations, aspects and/or the likeas described herein.

Accordingly, the system 100 as disclosed including the lead 102, thestress relief feature 106, the element 600, the zone 170, and/or thelike reduces the stress in the lead-solder interface 208 and thelead-solder interface 308.

Additionally, the system 100 as disclosed including the lead 102, thestress relief feature 106, the element 600, the zone 170, and/or thelike reduces solder fatigue in the lead-solder interface 208 and thelead-solder interface 308.

Additionally, the system 100 as disclosed including the lead 102, thestress relief feature 106, the element 600, the zone 170, and/or thelike reduces defects in the lead-solder interface 208 and thelead-solder interface 308.

Additionally, the system 100 as disclosed including the lead 102, thestress relief feature 106, the element 600, the zone 170, and/or thelike reduces failure modes and defects such as cracks, fatigue features,fractures, delamination, and/or the like in the connection between oneor more of the lead 102, the lead-solder interface 208, the lead-solderinterface 308, the pad 202, the pad 302, and the like.

Additionally, the system 100 as disclosed including the lead 102, thestress relief feature 106, the element 600, the zone 170, and/or thelike ensures a greater number of the devices 500 passing thermal shocktests, temperature cycle tests, and/or the like.

Moreover, the system 100 as disclosed including the lead 102, the stressrelief feature 106, elements 600, the zone 170, and/or the like ensuressignaling performance of the device 500 is maintained at a high level,is not substantially degraded, and the like.

While the disclosure has been described in terms of exemplary aspects,those skilled in the art will recognize that the disclosure can bepracticed with modifications in the spirit and scope of the appendedclaims. These examples given above are merely illustrative and are notmeant to be an exhaustive list of all possible designs, aspects,applications or modifications of the disclosure.

What is claimed is:
 1. A system configured to increase a reliability ofelectrical connections in a device, the system comprising: a leadconfigured to electrically connect a pad of at least one supportstructure to a pad of at least one electrical component; the leadincludes a first pad connection portion that includes a first uppersurface; the first pad connection portion configured to connect the leadto the pad of the at least one support structure; the lead includes asecond pad connection portion that includes a second upper surface; thesecond pad connection portion configured to connect the lead to the padof the at least one electrical component; the lead includes an upperportion that includes a lower surface arranged on a lower surfacethereof; and the upper portion being arranged between the first padconnection portion and the second pad connection portion, wherein thelower surface of the upper portion is arranged vertically above thefirst upper surface of the first pad connection portion; and wherein thelower surface of the upper portion is arranged vertically above thesecond upper surface of the second pad connection portion.
 2. The systemaccording to claim 1 wherein the upper portion comprises a curved convexconstruction.
 3. The system according to claim 1 wherein: the lead isconfigured to reduce stress in a first lead-solder interface arrangedbetween the first pad connection portion of the lead and the pad of theat least one support structure; and the lead is configured to reducestress in a second lead-solder interface arranged between the second padconnection portion of the lead and the pad of the at least oneelectrical component.
 4. The system according to claim 1 wherein: thelead includes a first connection portion that connects between the firstpad connection portion and the upper portion; and the lead includes asecond connection portion that connects between the second padconnection portion and the upper portion, wherein portions of the firstconnection portion are arranged vertically above the first upper surfaceof the first pad connection portion; and wherein portions of the secondconnection portion are arranged vertically above the second uppersurface of the second pad connection portion.
 5. The system according toclaim 1 wherein the lead includes a first connection portion thatconnects between the first pad connection portion and the upper portion;and the lead includes a second connection portion that connects betweenthe second pad connection portion and the upper portion, wherein thefirst connection portion and the second connection portion each comprisea concave construction.
 6. The system according to claim 1 wherein: thelead includes a first end portion and a second end portion; the firstend portion forming a terminating end of the lead and the second endportion forming another terminating end of the lead; and a curveddistance from the first end portion to the second end portion along thelead is greater than a linear distance from the first end portion to thesecond end portion.
 7. The system according to claim 1 wherein avertical height of an upper surface of the upper portion is 2 to 20times greater than a vertical height of the first pad connectionportion.
 8. The system according to claim 1 wherein the lead isconfigured to have a cross-sectional area smaller than a cross-sectionalarea of prior art leads.
 9. The system according to claim 1 furthercomprising: the at least one support structure; and an elementconfigured to alleviate signaling degradation through the lead, whereinthe element comprises a metallic construction; and wherein the elementis arranged in one of the following: on the at least one supportstructure or within the at least one support structure.
 10. The systemaccording to claim 9 wherein: the at least one support structurecomprises a zone that includes a limited number of additional features;and the element is arranged in the zone.
 11. The system according toclaim 10 wherein: the at least one support structure comprises aCo-Planar Wave Guide (CPWG) printed circuit board (PCB) having vias; andthe zone that includes the element does not include the vias.
 12. Thesystem according to claim 11 further comprising the at least oneelectrical component, wherein the electrical component comprises an RF(Radio Frequency) component.
 13. A process configured to increase areliability of electrical connections in a device, the processcomprising: forming a lead that is configured to electrically connect apad of at least one support structure to a pad of at least oneelectrical component; providing the lead with a first pad connectionportion that includes a first upper surface; configuring the first padconnection portion to connect the lead to the pad of the at least onesupport structure; providing the lead with a second pad connectionportion that includes a second upper surface; configuring the second padconnection portion to connect the lead to the pad of the at least oneelectrical component; arranging the lead to include an upper portionthat includes a lower surface arranged on a lower surface thereof;arranging the upper portion between the first pad connection portion andthe second pad connection portion; arranging the lower surface of theupper portion to be vertically above the first upper surface of thefirst pad connection portion; and arranging the lower surface of theupper portion to be arranged vertically above the second upper surfaceof the second pad connection portion.
 14. The process according to claim13 further comprising forming the upper portion to have a curved convexconstruction.
 15. The process according to claim 13 further comprising:implementing the lead to reduce stress in a first lead-solder interfacearranged between the first pad connection portion of the lead and thepad of the at least one support structure; and implementing the lead toreduce stress in a second lead-solder interface arranged between thesecond pad connection portion of the pad of the at least one electricalcomponent.
 16. The process according to claim 13 further comprising:configuring the lead to include a first connection portion that connectsbetween the first pad connection portion and the upper portion;configuring the lead to include a second connection portion thatconnects between the second pad connection portion and the upperportion; arranging portions of the first connection portion verticallyabove the first upper surface of the first pad connection portion; andarranging portions of the second connection portion vertically above thesecond upper surface of the second pad connection portion.
 17. Theprocess according to claim 13 wherein arranging the lead to include afirst connection portion that connects between the first pad connectionportion and the upper portion; arranging the lead to include a secondconnection portion that connects between the second pad connectionportion and the upper portion; and configuring the first connectionportion and the second connection portion to each have a concaveconstruction.
 18. The process according to claim 13 further comprising:configuring the lead to include a first end portion and a second endportion, the first end portion forming a terminating end of the lead andthe second end portion forming another terminating end of the lead; andconfiguring the lead such that a curved distance from the first endportion to the second end portion along the lead is greater than alinear distance from the first end portion to the second end portion.19. The process according to claim 13 further comprising configuring thelead such that a vertical height of an upper surface of the upperportion is 2 to 20 times greater than a vertical height of the first padconnection portion.
 20. The process according to claim 13 furthercomprising configuring the lead to have a cross-sectional area smallerthan a cross-sectional area of prior art leads.
 21. The processaccording to claim 13 further comprising: providing the at least onesupport structure; and arranging an element configured to alleviatesignaling degradation through the lead, wherein the element comprises ametallic construction; and wherein the element is arranged in one of thefollowing: on the at least one support structure or within the at leastone support structure.
 22. The process according to claim 21 furthercomprising: forming a zone that includes a limited number of additionalfeatures in the at least one support structure; and arranging theelement in the zone.
 23. The process according to claim 22 wherein: theat least one support structure comprises a Co-Planar Wave Guide (CPWG)printed circuit board (PCB) having vias; and the zone that includes theelement does not include the vias.
 24. The process according to claim 23further comprising providing the at least one electrical component,wherein the electrical component comprises an RF (Radio Frequency)component.